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3D IC Integration and Packaging
Language
English
English
Book
Hardback
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applicat...
Libristo code: 09043704
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527 b
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A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
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About the book
Full name
3D IC Integration and Packaging
Author
John Lau
Language
English
English
Binding
Book - Hardback
Date of issue
2015
Number of pages
480
EAN
9780071848060
ISBN
9780071848060
Libristo code
09043704
Publishers
McGraw-Hill Education - Europe
Weight
1028
Dimensions
196 x 245 x 28
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