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Area Array Package Design
Language
English
English
Book
Paperback
This engineering reference covers the most important new techniques in electronic packaging: flip ch...
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Libristo code: 07181188
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350 b
350 b
144.85
€
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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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About the book
Full name
Area Array Package Design
Author
Ken Gilleo
Language
English
English
Binding
Book - Paperback
Date of issue
2003
Number of pages
220
EAN
9780071737739
ISBN
9780071737739
Libristo code
07181188
Publishers
McGraw-Hill
Weight
386
Dimensions
190 x 235 x 12
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