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Direct Copper Interconnection for Advanced Semiconductor Technology

Language EnglishEnglish
Book Hardback
Book Direct Copper Interconnection for Advanced Semiconductor Technology Dongkai Shangguan
Libristo code: 45136390
Publishers Taylor & Francis Ltd, June 2024
In the "More than Moore" era, performance requirements for leading edge semiconductor devices are de...
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244.74 €
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In the "More than Moore" era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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About the book

Full name Direct Copper Interconnection for Advanced Semiconductor Technology
Author Dongkai Shangguan
Language English
Binding Book - Hardback
Date of issue 2024
Number of pages 250
EAN 9781032528236
Libristo code 45136390
Publishers Taylor & Francis Ltd
Weight 836
Dimensions 156 x 234

Categories

Economics, Finance, Business & Management > Business & Management > Management & management techniques > Management of specific areas > Production & quality control management
Economics, Finance, Business & Management > Business & Management > Management & management techniques > Management of specific areas > Purchasing & supply management
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Automatic control engineering
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Microwave technology
Economics, Finance, Business & Management > Industry & industrial studies > Media, entertainment, information & communication industries
Technology, Engineering, Agriculture > Technology: general issues > Engineering: general
Technology, Engineering, Agriculture > Mechanical engineering & materials > Mechanical engineering
Technology, Engineering, Agriculture > Energy technology & engineering > Electrical engineering
Technology, Engineering, Agriculture > Environmental science, engineering & technology
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