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Electronic Packaging for High Reliability, Low Cost Electronics

Language EnglishEnglish
Book Hardback
Book Electronic Packaging for High Reliability, Low Cost Electronics Rao R. Tummala
Libristo code: 01395791
Publishers Springer, February 2000
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New pac... Full description
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154.01 €
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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About the book

Full name Electronic Packaging for High Reliability, Low Cost Electronics
Author Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic
Language English
Binding Book - Hardback
Date of issue 2000
Number of pages 296
EAN 9780792352181
ISBN 0792352181
Libristo code 01395791
Publishers Springer
Weight 1360
Dimensions 155 x 235 x 21

Categories

Technology, Engineering, Agriculture > Mechanical engineering & materials > Materials science > Testing of materials
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Technology, Engineering, Agriculture > Energy technology & engineering > Electrical engineering
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