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Foldable Flex and Thinned Silicon Multichip Packaging Technology

Language EnglishEnglish
Book Paperback
Book Foldable Flex and Thinned Silicon Multichip Packaging Technology John W. Balde
Libristo code: 05181543
Publishers Springer-Verlag New York Inc., February 2014
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods use... Full description
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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.§

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About the book

Full name Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author John W. Balde
Language English
Binding Book - Paperback
Date of issue 2014
Number of pages 347
EAN 9781461349778
ISBN 146134977X
Libristo code 05181543
Weight 569
Dimensions 155 x 235 x 21
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