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Microelectronics Packaging Handbook

Subsystem Packaging Part III

Language EnglishEnglish
Book Hardback
Book Microelectronics Packaging Handbook Alan G. Klopfenstein
Libristo code: 07184680
Publishers Chapman and Hall, January 1997
Provides information on microelectronics design methods, modeling tools, simulation techniques, and... Full description
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175.92 €
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Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry.

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About the book

Full name Microelectronics Packaging Handbook
Author Alan G. Klopfenstein
Language English
Binding Book - Hardback
Date of issue 1997
Number of pages 628
EAN 9780412084515
ISBN 9780412084515
Libristo code 07184680
Publishers Chapman and Hall
Weight 2430
Dimensions 155 x 235 x 43

Categories

Reference, Information & Interdisciplinary subjects > Encyclopaedias & reference works > Reference works
Technology, Engineering, Agriculture > Technology: general issues > Technical design
Technology, Engineering, Agriculture > Energy technology & engineering > Electrical engineering
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering
The Arts > Industrial / commercial art & design
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