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Language
English
English
Book
Hardback
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms,...
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Libristo code: 49699488
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390 b
390 b
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This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
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About the book
Full name
Reliability Technology for Integrated Circuit Packaging
Language
English
English
Binding
Book - Hardback
Date of issue
2026
Number of pages
509
EAN
9789819538843
ISBN
981953884X
Libristo code
49699488
Publishers
Springer-Verlag GmbH
Weight
1010
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