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Three Dimensional System Integration

Name: Three Dimensional System Integration
Brand: Springer-Verlag New York Inc.
SKU: 01420524
Price: 58.53 EUR
Availability: InStock
Author: Antonis Papanikolaou
ISBN: 9781441909619

IC Stacking Process and Design

Antonis Papanikolaou

Dimitrios Soudris

Riko Radojcic

Language

English

Book Hardback

Libristo code: 01420524

Publishers Springer-Verlag New York Inc., January 2010

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system in... Full description

Libristo code: 01420524

141 b

58.53 €

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. §§This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.