Check order status

Become part of a community of book lovers from all over the world and get access to a whole bunch of benefits. Create an account for free

DPD courier 4.99 € GLS courier 9.99 €

Contact

How to shop

Help

My account

▸ Empty :-(

Wafer Level 3-D ICs Process Technology

Name: Wafer Level 3-D ICs Process Technology
Brand: Springer-Verlag New York Inc.
SKU: 01423024
Price: 175.2 EUR
Availability: InStock
Author: Chuan Seng Tan
ISBN: 9781441945624

Chuan Seng Tan

Ronald J. Gutmann

L. Rafael Reif

Language

English

Book Paperback

Libristo code: 01423024

Publishers Springer-Verlag New York Inc., October 2010

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The c... Full description

Libristo code: 01423024

425 b

175.20 €

Low in stock at our supplier Shipping in 11-15 days

Up to 30 days for returns

Customers also purchased

Hochbegabung und Underachievement. Welche Relevanz hat die Hochbegabung für Lehrkräfte? Anonym

Paperback

16.14 €

Scrivere i Vangeli. Composizione e memoria Eric Eve

Paperback

27.44 €

LA NOCHE EN LA QUE LLEGUÈ AL CASTILLO EMILY CARROLL

Hardback

23.20 €

Des tomates presque sans eau Jean-Yves Meignen

Paperback

14.83 €

Wundervolle Welt der Dinosaurier und der Urzeit Angela Rizza

Hardback

21.08 €

Die Industrie Bulgariens, Mit Besonderer Berücksichtigung Der Mehl- Und Wollindustrie Georg Entscheff

Hardback

32.49 €

Aussprache verbessern: Methoden und Übungen für Zuhause Felice Schäfer

Paperback

15.94 €

HURRA!!! PO POLSKU 3 Podrecznik Studenta. Nowa Edycja Agnieszka Jasinska

Hardback

22.29 €

Le Cri Des Africains Contre Les Europeens, Leurs Oppresseurs Ou Coup D'Oeil (1821) Thomas Clarkson

Paperback

21.18 €

Histoire De Charles VII V2: Le Roi De Bourges, 1422-1435 (1882) Gaston Du Fresne De Beaucourt

Hardback

62.67 €

12 Practice Activities for Numbers zero to one hundred in Spanish: Includes Answers for all Activities Esther Boateng

Paperback

10.28 €

Przepraszam Czechów i Słowaków Szuszczyński Paweł

Paperback

9.48 €

NUITS D'ENFER A CAMBRAI WOUTERS

Paperback

10.79 €

FORMACION E DINAMICA DAS RIAS GALEGAS MARTINEZ GRAÑA

binding.

13.51 €

Nemůžete za to vy, ale on Georgia Witkinová

Hardback

7.05 €

Die Urologie Maurice Stephan Michel

Hardback

420.25 €

Grundlagen der Gemeinkostenplanung in der flexiblen Plankostenrechnung Matthias Renkel

Paperback

17.05 €

guarda y custodia compartida de los hijos Karen Lissette Echeverría Guevara

Paperback

47.12 €

Golf GTI Ken Cservenka

Paperback

12.20 €

Menschen und Aliens in Star Trek Guido Kattwinkel

Paperback

35.62 €

Conni Gelbe Reihe (Beschäftigungsbuch): Zahlen schreiben Extra Hanna Sörensen

Paperback

4.53 €

Studio d C1 Hermann Funk

Audio CD

28.96 €

Le Monde Arabe dans la diplomatie turque "Tome1" Shaimaa Magued

Paperback

84.26 €

Frauen ohne Wohnung Kathrin Macke

Paperback

39.35 €

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.