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Reliability Technology for Integrated Circuit Packaging

Language EnglishEnglish
E-book Adobe ePub DRM
Publishers Springer, April 2026
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms,... Full description
? points 451 b New New
185.99
In stock Immediate digital delivery

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "e;high-quality development"e; a focus on reliability is essential to advancing manufacturing.Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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About the book

Full name Reliability Technology for Integrated Circuit Packaging
Language English
Binding E-book - Adobe ePub DRM
Date of issue 2026
EAN 9789819538850
Libristo code 52368656
Publishers Springer
Series Engineering
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